A high-end sensor chip company encountered fluctuations in hermetic packaging yield during the product mass production stage.Through the introduction of Hiraysi's fully automatic inspection solution, 100% online inspection of wafer bonding quality has been achieved.After the project was implemented, the product packaging yield rate increased steadily from 98.5% to 99.97%, the annual quality cost was reduced by more than 6 million yuan, and the company successfully entered the automotive electronics pre-installation market.

Relying on our technical accumulation in the field of chip packaging and inspection, we have provided professional solutions to many leading semiconductor companies.Welcome to contact us to get a customized testing solution for your product.